Coated Wafer

The mobile phone camera module is divided into three parts from the cut surface: CMOS sensor chip, IR-Cut Filter, and lens. The mobile phone camera module manufacturer purchases three components and then assembles it. With the continuous development of technology, CMOS sensor chip manufacturers use WLP (Wafer Level Package) technology to bond 6-inch or 8-inch wafers, lenses, and IR-Cut Filters, and then cut them into thousands The camera module, the new module after cutting is half smaller than the traditional module.